November 1st, 2012

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

SMTA Michigan Chapter Solder Paste Roundtable
November 8th, 2012

The Michigan SMTA is holding a Solder Paste Round table on November 8th, 2012. The meeting will be at the Dearborn Country Club in Dearborn, MI. We have setup the meeting so the topics are specified to the speakers and will not overlap in content. This will help keep the meeting informative and interesting. There will be a question and answer round table at the end of the meeting for open discussion on solder paste issues. The Ohio chapter put on a similar meeting a few months ago. I attended that meeting and found it to be extremely informative with a lot of great content and dialog. I believe we will have an equally informative meeting here in MI!

9AM registration
9:25AM- Welcome and Opening
9:30-10:20 - Alpha
10:20-10:30- Break
10:30-11:20- Indium
11:20-11:30- Break
11:30- 12:20 -Multicore
12:20- lunch
12:45-1:15- DEK (Mike will begin speaking while lunch is being finished)
1:15-2pm- round table discussion

Topics are:

*Low Temperature Soldering. ALSO- When to use Type 4 solder paste
Robert Wallace, Alpha

*Impact of Component Miniaturization ALSO- Defect Analysis including HIP, Graping, and Other Undesired Reflow Phenomena
Mario Scalzo, Indium Corporation

*Solder Paste Shelf Life & PrintabilityALSO- Development of a Novel Lead Free Solder for High Reliability Applications
Dave Edwards, Henkel Electronics

*Stencil Nano Coatings and other emerging stencil technologies. Also, how stencil cleanliness affects printing and overall quality
Mike Burgess, DEK

All info also available at: http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=23