November 1st, 2012
OF THE SMTA Get Connected
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
SMTA Michigan Chapter Solder Paste Roundtable
November 8th, 2012
Pre-Registration will be requested, but not required.
If at all possible, please pre-register by sending an email to me at firstname.lastname@example.org or to Mark Hoch at email@example.com (chapter secretary), this will help us with a head count for food preparation.
Payment will be taken at the door.
Cost for this meeting is $15 for members, $25 for non-members. Lunch is included!!!
Cash or check only, no credit cards, sorry.
9:25AM- Welcome and Opening
9:30-10:20 - Alpha
11:30- 12:20 -Multicore
12:45-1:15- DEK (Mike will begin speaking while lunch is being finished)
1:15-2pm- round table discussion
*Low Temperature Soldering. ALSO- When to use Type 4 solder paste
Robert Wallace, Alpha
*Impact of Component Miniaturization ALSO- Defect Analysis including HIP, Graping, and Other Undesired Reflow Phenomena
Mario Scalzo, Indium Corporation
*Solder Paste Shelf Life & PrintabilityALSO- Development of a Novel Lead Free Solder for High Reliability Applications
Dave Edwards, Henkel Electronics
*Stencil Nano Coatings and other emerging stencil technologies. Also, how stencil cleanliness affects printing and overall quality
Mike Burgess, DEK
All info also available at: http://www.smta.org/chapters/chapters_detail.cfm?chapter_id=23